Silicon wafer slicing diamond wire manufacturer

Specifications:

• Excellent tension control and yield strength 50% faster thanconventional cutting process High precision and good surfaceperformance Precise control for wire diameter, uniform wire shape

Description:

Excellent tension control and yield strength 50% faster thanconventional cutting process High precision and good surfaceperformance Precise control for wire diameter, uniform wire shapeOur consumable parts range includes diamond grinding wheel, diamondedge grinding wheel, diamond wire, guide roller, main roller,roller coating, roller re-grooving, supply spool pulley, wirepulley, wire, epoxy resin lapping carrier, reinforced fiberglasslapping carrier, blue steel lapping carrier, cast iron dressingplate, double side washing brush, boron carbide power, boroncarbide slurry pump, automatic magnetic stirrer, wax ceramic block/ceramic bonding plate, composite resin copper polishing plate, OFHCpure cooper polishing plate, facing bite and grooving bite,condition ring with ceramic segments etc. We always keep Homraybusiness philosophy "customer satisfaction is always ourunremitting pursuit" in our minds. Owning CE, ISO Certification& Quality Control System as our quality guarantee, we won goodfeedback from our customers in the world.
Silicon wafer slicing diamond wire manufacturer